ARS Advances in Radio Science ARS Adv. Radio Sci. 1684-9973 Copernicus Publications Göttingen, Germany 10.5194/ars-7-11-2009 Comparison of methods for broadband electromagnetic characterization of Molded Interconnect Device materials Orlob C. 1 Kornek D. 1 Preihs S. 1 Rolfes I. 1 Leibniz Universität Hannover, Institut für Hochfrequenztechnik und Funksysteme, Appelstr. 9A, 30167 Hannover, Germany 18 05 2009 7 11 15 Copyright: © 2009 C. Orlob et al. 2009 This work is licensed under the Creative Commons Attribution 3.0 Unported License. To view a copy of this licence, visit https://creativecommons.org/licenses/by/3.0/ This article is available from https://ars.copernicus.org/articles/7/11/2009/ars-7-11-2009.html The full text article is available as a PDF file from https://ars.copernicus.org/articles/7/11/2009/ars-7-11-2009.pdf

Combining the Molded Interconnect Device technology with the Laser Direct Structuring technology exhibits the potential of designing electrical and mechanical components on three-dimensional surfaces to increase functionality, level of integration and to reduce costs. When taking advantage of this technology especially in the design of RF devices, a precise knowledge of the electromagnetic parameters of the MID material is required, as the complex permeability and permittivity strongly influence the device performance. At present time, these materials are not electromagnetically characterized in the RF frequency range. In this paper different methods are therefore presented and compared with respect to their potentials for broadband electromagnetic characterization of Molded Interconnect Device materials.

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