Advances in Radio Science
Advances in Radio Science
ARS
Articles | Volume 16
Articles | Volume 16
https://doi.org/10.5194/ars-16-109-2018
© Author(s) 2018. This work is distributed under
the Creative Commons Attribution 4.0 License.
https://doi.org/10.5194/ars-16-109-2018
© Author(s) 2018. This work is distributed under
the Creative Commons Attribution 4.0 License.
Articles | Volume 16
04 Sep 2018
 | 04 Sep 2018

Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications

Amro Eldebiky, Mourad Elsobky, Harald Richter, and Joachim N. Burghartz

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Cited articles

Alavi, G., Sailer, H., Albrecht, B., Harendt, C., and Burghartz, J. N.: Adaptive Layout Technique for Microhybrid Integration of Chip-Film Patch, IEEE T. Compon. Pack. T., 8, 802–810, 2018. a
Cartasegna, D., Conso, F., Donida, A., Grassi, M., Picolli, L., Rescio, G., Malcovati, P., Perretti, G., and Regnicoli, G.: Integrated microsystem with humidity, temperature and light sensors for monitoring the preservation conditions of food, IEEE Sensors Conference, 28–31 October 2011, 1859–1862, 2011. a
Elsobky, M., Albrecht, B., Richter, H., Burghartz, J. N., Ganter, P., Szendrei, K., and Lotsch, B. V.: Ultra-thin Relative Humidity Sensors for Hybrid System-in-Foil Applications, IEEE Sensors Conference, 29 October–1 November 2017, 1–3, 2017. a, b, c
Elsobky, M., Mahsereci, Y., Yu, Z., Richter, H., Burghartz, J. N., Keck, J., Klauk, H. and Zschieschang, U.: Ultra-thin smart electronic skin based on hybrid system-in-foil concept combining three flexible electronics technologies, in Electron. Lett., 54, 338–340, 2018. a
EM Microelectronic- Marin SA: Sub-1V (0.6V) 8bit Flash MCU DC-DC Converter, E2PROM, available at: http://www.emmicroelectronic.com/, last access: 28 August 2017. a, b
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Short summary
Hybrid System-in-Foil (HySiF) is one of the emerging branches of flexible electronics in which ultra-thin silicon chips are integrated with flexible sensors in polymeric foils. Intensive attention was given to the implementation of flexible environmental sensing platforms for logistics and food packaging. The aim of this work is the implementation of a sensor system demonstrator using HySiF components: an ultra-thin microcontroller chip, an on-chip temperature, and an on-foil humidity sensors.
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