
|
10 Nov 2014
Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)
E. Glocker, S. Boppu, Q. Chen, U. Schlichtmann, J. Teich, and D. Schmitt-Landsiedel
Viewed
Total article views: 1,747 (including HTML, PDF, and XML)
HTML |
PDF |
XML |
Total |
BibTeX |
EndNote |
919 |
714 |
114 |
1,747 |
156 |
183 |
- HTML: 919
- PDF: 714
- XML: 114
- Total: 1,747
- BibTeX: 156
- EndNote: 183
Views and downloads (calculated since 10 Nov 2014)
Cumulative views and downloads
(calculated since 10 Nov 2014)
Latest update: 13 Sep 2025