|
10 Nov 2014
Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)
E. Glocker, S. Boppu, Q. Chen, U. Schlichtmann, J. Teich, and D. Schmitt-Landsiedel
Viewed
Total article views: 2,113 (including HTML, PDF, and XML)
| HTML |
PDF |
XML |
Total |
BibTeX |
EndNote |
| 1,148 |
818 |
147 |
2,113 |
188 |
253 |
- HTML: 1,148
- PDF: 818
- XML: 147
- Total: 2,113
- BibTeX: 188
- EndNote: 253
Views and downloads (calculated since 10 Nov 2014)
Cumulative views and downloads
(calculated since 10 Nov 2014)
Latest update: 22 Aug 2026
