Articles | Volume 12
https://doi.org/10.5194/ars-12-103-2014
https://doi.org/10.5194/ars-12-103-2014
10 Nov 2014
 | 10 Nov 2014

Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

E. Glocker, S. Boppu, Q. Chen, U. Schlichtmann, J. Teich, and D. Schmitt-Landsiedel

Viewed

Total article views: 2,005 (including HTML, PDF, and XML)
HTML PDF XML Total BibTeX EndNote
1,093 779 133 2,005 176 236
  • HTML: 1,093
  • PDF: 779
  • XML: 133
  • Total: 2,005
  • BibTeX: 176
  • EndNote: 236
Views and downloads (calculated since 10 Nov 2014)
Cumulative views and downloads (calculated since 10 Nov 2014)
Latest update: 16 Mar 2026
Download
Share