Articles | Volume 12
https://doi.org/10.5194/ars-12-103-2014
https://doi.org/10.5194/ars-12-103-2014
10 Nov 2014
 | 10 Nov 2014

Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

E. Glocker, S. Boppu, Q. Chen, U. Schlichtmann, J. Teich, and D. Schmitt-Landsiedel

Cited articles

Atienza, D., Del Valle, P. G., Paci, G., Poletti, F., Benini, L., De Micheli, G., and Mendias, J. M.: A Fast HW/SW FPGA-Based Thermal Emulation Framework for Multi-Processor System-on-Chip, Design Automation Conference (DAC'06), pp. 618–623, 2006.
Bartolini, A., Cacciari, M., Tilli, A., and Benini, L.: Thermal and Energy Management of High-Performance Multicores: Distributed and Self-Calibrating Model-Predictive Controller, IEEE T. Parall. Distr., 24, 170–183, 2013.
Brooks, D., Dick, R. P., Joseph, R., and Li Shang: Power, Thermal, and Reliability Modeling in Nanometer-Scale Microprocessors, IEEE Micro, 27, 49–62, 2007.
Glocker, E. and Schmitt-Landsiedel, D.: Modeling of temperature scenarios in a multicore processor system, Adv. Radio Sci., 11, 219–225, https://doi.org/10.5194/ars-11-219-2013, 2013.
Hannig, F., Schmid, M., Lari, V., Boppu, S., and Teich, J.: System Integration of Tightly-Coupled Processor Arrays using Reconfigurable Buffer Structures, Proceedings of the ACM International Conference on Computing Frontiers 2013 (CF'13), ACM, 2:1–2:4, 2013.
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