Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges

Elsobky, Mourad; Mahsereci, Yigit; Keck, Jürgen; Richter, Harald; Burghartz, Joachim N.

doi:https://doi.org/10.5194/ars-15-123-2017

Articles | Volume 15

https://doi.org/10.5194/ars-15-123-2017

© Author(s) 2017. This work is distributed under
the Creative Commons Attribution 3.0 License.

https://doi.org/10.5194/ars-15-123-2017

© Author(s) 2017. This work is distributed under
the Creative Commons Attribution 3.0 License.

Articles | Volume 15

21 Sep 2017

| 21 Sep 2017

Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges

Mourad Elsobky, Yigit Mahsereci, Jürgen Keck, Harald Richter, and Joachim N. Burghartz

Data sets

Design of a CMOS Readout Circuit on Ultra-thin Flexible Silicon Chip for Printed Strain Gauges M. Elsobky https://doi.org/10.17632/wz9kwf7grv.2

Short summary

A flexible Hybrid System-in-Foil (HySiF) is designed to be used as an electronic skin for robotic applications. At IMS CHIPS, we believe that the future of flexible electronics relies on the integration of multiple electronic components on a single substrate. Our system comprises of an array of printed strain gauges and ultrathin flexible silicon chips, which demonstrates the complementary benefits of combining the low-cost printed electronics and the high performance silicon technologies.