Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges
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Cited articles
Baker, R. J.: CMOS Circuit Design, Layout, and Simulation, Wiley, 2010.
Burghartz, J. N., Appel, W., Harendt, C., Rempp, H., Richter, H., and Zimmermann, M.: Ultra-Thin Chips and Related Applications, A New Paradigm in Silicon Technology, in: European Solid State Device Research Conference, 29–36, 2009.
Elsobky, M.: Design of a CMOS Readout Circuit on Ultra-thin Flexible Silicon Chip for Printed Strain Gauges, Mendeley Data, v2, https://doi.org/10.17632/wz9kwf7grv.2, 2017.
Harendt, C., Yu, Z., Burghartz, J. N., Kugler, A., Kostelnik, J., and Saller, S.: Hybrid System in Foil (HYSiF) Exploiting ultra-thin flexible chips, in: European Solid State Device Research Conference, 210–213, 2014.
Hassan, M. U., Schomburg, C., Harendt, C., Penteker, E., and Burghartz, J. N.: Assembly and Embedding of Ultra-Thin Chips in Polymers, in: European Microelectronics Packing Conference, 1–6, 2013.