Articles | Volume 15
https://doi.org/10.5194/ars-15-123-2017
https://doi.org/10.5194/ars-15-123-2017
21 Sep 2017
 | 21 Sep 2017

Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges

Mourad Elsobky, Yigit Mahsereci, Jürgen Keck, Harald Richter, and Joachim N. Burghartz

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Cited articles

Baker, R. J.: CMOS Circuit Design, Layout, and Simulation, Wiley, 2010.
Burghartz, J. N., Appel, W., Harendt, C., Rempp, H., Richter, H., and Zimmermann, M.: Ultra-Thin Chips and Related Applications, A New Paradigm in Silicon Technology, in: European Solid State Device Research Conference, 29–36, 2009.
Elsobky, M.: Design of a CMOS Readout Circuit on Ultra-thin Flexible Silicon Chip for Printed Strain Gauges, Mendeley Data, v2, https://doi.org/10.17632/wz9kwf7grv.2, 2017.
Harendt, C., Yu, Z., Burghartz, J. N., Kugler, A., Kostelnik, J., and Saller, S.: Hybrid System in Foil (HYSiF) Exploiting ultra-thin flexible chips, in: European Solid State Device Research Conference, 210–213, 2014.
Hassan, M. U., Schomburg, C., Harendt, C., Penteker, E., and Burghartz, J. N.: Assembly and Embedding of Ultra-Thin Chips in Polymers, in: European Microelectronics Packing Conference, 1–6, 2013.
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Short summary
A flexible Hybrid System-in-Foil (HySiF) is designed to be used as an electronic skin for robotic applications. At IMS CHIPS, we believe that the future of flexible electronics relies on the integration of multiple electronic components on a single substrate. Our system comprises of an array of printed strain gauges and ultrathin flexible silicon chips, which demonstrates the complementary benefits of combining the low-cost printed electronics and the high performance silicon technologies.