Advances in Radio Science
Advances in Radio Science
ARS
Articles | Volume 15
Articles | Volume 15
https://doi.org/10.5194/ars-15-123-2017
© Author(s) 2017. This work is distributed under
the Creative Commons Attribution 3.0 License.
https://doi.org/10.5194/ars-15-123-2017
© Author(s) 2017. This work is distributed under
the Creative Commons Attribution 3.0 License.
Articles | Volume 15
21 Sep 2017
 | 21 Sep 2017

Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges

Mourad Elsobky, Yigit Mahsereci, Jürgen Keck, Harald Richter, and Joachim N. Burghartz

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Short summary
A flexible Hybrid System-in-Foil (HySiF) is designed to be used as an electronic skin for robotic applications. At IMS CHIPS, we believe that the future of flexible electronics relies on the integration of multiple electronic components on a single substrate. Our system comprises of an array of printed strain gauges and ultrathin flexible silicon chips, which demonstrates the complementary benefits of combining the low-cost printed electronics and the high performance silicon technologies.
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