Yield-improving test and routing circuits for a novel 3-D interconnect technology
Cited articles
Bschorr, M., Pfleiderer, H.-J., Munding, A., Kaiser, A., Benkart, P., Kohn, E., Heittmann, A., Hübner, H., and Ramacher, U.: Eine Test- und Ansteuerschaltung für eine neuartige 3D Verbindungstechnologie, Advanves in Radio Science, 3, 305–310, 2005.
Heittmann, A., Ramacher, U., Matolin, D., Schreiter, J., and Schüffny, R.: An Analog VLSI Pulsed Neural Network for Image Segmentation Using Adaptive Connection Weights, ICANN 2002 Proceedings, Madrid, Spain, 2415, 1293–1298, 2002.
Munding, A., Kaiser, A., Benkart, P., Bschorr, M., Heittmann, A., Hübner, H., Pfleiderer, H.-J., Ramacher, U., and Kohn, E.: Chip Stacking Technology for 3D-Integration of Sensor Systems, HETECH 2004, 13th European workshop on heterostructure technology, October 2004, Heraklion, Greece, 2004.
Schreiter, J., Ramacher, U., Heittmann, A., Matolin, D., and Schüffny, R.: Cellular Pulse Coupled Neural Network with Adaptive Weights for Image Segmentation and its VLSI Implementation, SPIE, San Jose (CA), USA, 5298, 290–296, 2004.